DS3232S# vs DS3232SN#

Component comparison · Last verified 2026-07-27

Choose DS3232S# for commercial-temperature systems operating from 0 deg C to +70 deg C. Choose DS3232SN# when the same 236-byte battery-backed SRAM, integrated TCXO, I2C interface and 20-pin package must be qualified from -40 deg C to +85 deg C. The functional design is shared, but the exact temperature grade and applicable accuracy range must remain part of the BOM decision.

DS3232S# vs DS3232SN# specifications

SpecificationDS3232S#DS3232SN#
Orderable temperature gradeCommercialIndustrial
Operating temperature range0 deg C to +70 deg C-40 deg C to +85 deg C
Accuracy from 0 deg C to +40 deg C+/-2 ppm+/-2 ppm
Accuracy outside 0 deg C to +40 deg C+/-3.5 ppm from +40 deg C to +70 deg C+/-3.5 ppm from -40 deg C to 0 deg C and +40 deg C to +85 deg C
Serial interfaceI2C up to 400 kHzI2C up to 400 kHz
Battery-backed SRAM236 bytes236 bytes
TimebaseIntegrated crystal and TCXOIntegrated crystal and TCXO
Time-of-day alarmsTwoTwo
Supply voltage2.3 V to 5.5 V2.3 V to 5.5 V
Package / case20-pin wide SOIC, 300 mil20-pin wide SOIC, 300 mil

Key differences

The suffix selects the qualified ambient-temperature range

DS3232S# is the commercial-temperature code specified from 0 deg C to +70 deg C. DS3232SN# is the industrial-temperature code specified from -40 deg C to +85 deg C, covering cold-start and higher-ambient requirements outside the commercial range.

The applicable full-range accuracy statement follows the grade

Both codes specify +/-2 ppm from 0 deg C to +40 deg C. The industrial DS3232SN# code also carries the DS3232 +/-3.5 ppm specification across the negative-temperature region and through +85 deg C, while DS3232S# is bounded by +70 deg C.

The exact suffix remains a qualification and sourcing requirement

Interface, SRAM, package and core functions align, but an AVL, customer drawing or environmental test record may explicitly require the industrial N suffix. Quotes and incoming inspection should preserve the complete orderable code.

Can these parts be interchanged?

DS3232S# and DS3232SN# share the DS3232 electrical function, register map, 236-byte battery-backed SRAM and 20-pin wide SOIC footprint, but substitution still requires controlled review. Confirm the exact temperature grade, accuracy limits across the product environment, current lifecycle, packing suffix, top marking and customer or regulatory qualification before changing the approved BOM.

Replacement verification checklist
  • Electrical ratings and operating conditions
  • Package dimensions, footprint and pinout
  • Interface, timing and firmware behavior
  • Temperature and qualification grade
  • Lifecycle status and current documentation revision

DS3232S# vs DS3232SN# FAQ

What is the main difference between DS3232S# and DS3232SN#?

The difference is temperature grade. DS3232S# is specified from 0 deg C to +70 deg C, while DS3232SN# is specified from -40 deg C to +85 deg C.

Do DS3232S# and DS3232SN# provide the same SRAM and interface?

Yes. Both provide 236 bytes of battery-backed SRAM, an I2C interface up to 400 kHz, two alarms and the same integrated-crystal TCXO architecture.

Is the timekeeping accuracy identical for both orderable codes?

Both specify +/-2 ppm from 0 deg C to +40 deg C. DS3232SN# additionally covers the industrial low- and high-temperature regions under the DS3232 full-range accuracy specification.

Can DS3232SN# replace DS3232S#?

The electrical function and package align, but the change should still pass BOM, sourcing and qualification control. Verify the complete suffix, documentation revision, lifecycle and any customer approval requirement.

When should DS3232SN# be selected?

Select DS3232SN# when equipment must operate below 0 deg C, above +70 deg C, or when the product specification explicitly requires an industrial-temperature RTC.

Sources and verification

This comparison supports preliminary selection and sourcing review. Similar specifications do not establish drop-in compatibility. Confirm the complete orderable code and current manufacturer documentation before design release or purchase.

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