Component comparison · Last verified 2026-08-13
MT40A1G16KD-062E:E and MT40A1G16TB-062E:F are 16Gb, 1.2V DDR4 x16 components with the same 3200MT/s and CL22 catalog profile, but they are not equivalent procurement choices. The KD code is End of Life in a 9.00 x 13.00 mm body, while the TB code is Production in a 7.50 x 13.00 mm body with different dry-pack and reel quantities.
MT40A1G16KD-062E:E vs MT40A1G16TB-062E:F specifications
| Specification | MT40A1G16KD-062E:E | MT40A1G16TB-062E:F |
|---|---|---|
| Verified ordering code | MT40A1G16KD-062E:E | MT40A1G16TB-062E:F |
| Memory density | 16Gb | 16Gb |
| Technology | DDR4 | DDR4 |
| I/O voltage | 1.2V | 1.2V |
| Bus width | x16 | x16 |
| Component configuration | 1Gb x16 | 1Gb x16 |
| Clock speed | 1600MHz | 1600MHz |
| Transfer rate | 3200MT/s | 3200MT/s |
| CAS latency | CL22 | CL22 |
| Package and ball count | 96-ball TFBGA | 96-ball TFBGA |
| Package dimensions | 9.00 x 13.00 x 1.20 mm | 7.50 x 13.00 x 1.20 mm |
| Operating temperature | 0C to +95C | 0C to +95C |
| Micron catalog lifecycle | End of Life | Production |
| Dry-pack quantity | 1,140 | 1,020 |
| Tape-and-reel quantity | 3,000 | 2,000 |
Key differences
Production status changes the sourcing decision
Micron lists MT40A1G16KD-062E:E as End of Life and MT40A1G16TB-062E:F as Production. A new design should not treat the two records as equally supportable: the KD option requires remaining-life, traceability and last-time-buy review, while the TB option still requires a current factory and revision check at quotation time.
The package body and shipment quantities require separate qualification
Both records are 96-ball TFBGA devices, but Micron lists a 9.00 x 13.00 mm KD body and a 7.50 x 13.00 mm TB body. The official catalog also lists different dry-pack and tape-and-reel quantities. Confirm the exact package drawing, ball map, land pattern, pick-and-place setup, tray or reel format and moisture-handling workflow before changing the complete order code.
Can these parts be interchanged?
The two order codes share the same catalog-level 16Gb DDR4 x16, 1.2V, 1600MHz clock, 3200MT/s transfer-rate, CL22 and 0C to +95C profile. That electrical overlap does not prove drop-in compatibility. The package bodies and packing quantities differ, and the lifecycle positions are materially different. Verify the revision-controlled data sheet, exact package drawing, ball assignment, PCB land pattern, controller timing, signal integrity, power-up behavior, thermal margin, firmware initialization and current Micron orderability before qualification or substitution.
- Electrical ratings and operating conditions
- Package dimensions, footprint and pinout
- Interface, timing and firmware behavior
- Temperature and qualification grade
- Lifecycle status and current documentation revision
MT40A1G16KD-062E:E vs MT40A1G16TB-062E:F FAQ
What is the main difference between MT40A1G16KD-062E:E and MT40A1G16TB-062E:F?
Micron lists the KD code as End of Life and the TB code as Production. Their 96-ball TFBGA body dimensions and factory packing quantities also differ, despite sharing the same catalog-level DDR4 density, width, speed and voltage profile.
Are MT40A1G16KD-062E:E and MT40A1G16TB-062E:F drop-in replacements?
Do not assume so. Both use 96-ball TFBGA packaging, but the listed body widths differ. Review the exact package drawing, ball map, land pattern, controller timing, power and firmware requirements before any substitution.
Which part is the current-production choice?
Micron's current catalog lists MT40A1G16TB-062E:F as Production. The official obsolete catalog lists MT40A1G16KD-062E:E as End of Life. Recheck live factory support and the complete ordering code when requesting a quote.
Do the two parts share the same key memory profile?
Yes at the catalog-selection level: both are 16Gb DDR4 x16, 1.2V, 1Gb x16 devices listed at 1600MHz, 3200MT/s and CL22 with a 0C to +95C operating range.
What must be checked before moving from the KD code to the TB code?
Check the exact data-sheet revision, package drawing, ball assignment, PCB footprint, signal-integrity and timing model, power-up sequence, firmware setup, thermal margin, tray or reel format, moisture handling, lifecycle and current orderability.
Sources and verification
- Micron MT40A1G16KD-062E:E exact obsolete-part detail
- Micron MT40A1G16TB-062E:F exact current-part detail
- Micron DDR4 SDRAM part catalog
This comparison supports preliminary selection and sourcing review. Similar specifications do not establish drop-in compatibility. Confirm the complete orderable code and current manufacturer documentation before design release or purchase.
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