MT25QL01GBBB8E12-0AAT vs MT25QL01GBBB8E12-0AUT

Component comparison · Last verified 2026-08-04

MT25QL01GBBB8E12-0AAT and MT25QL01GBBB8E12-0AUT are 1Gb, 3.0V, x4 SPI Serial NOR devices in the same TBGA package, but they target different operating grades. Choose the -0AUT option when the design requires operation through +125°C; choose -0AAT when its +105°C ceiling and Production catalog status fit the qualified sourcing plan.

MT25QL01GBBB8E12-0AAT vs MT25QL01GBBB8E12-0AUT specifications

SpecificationMT25QL01GBBB8E12-0AATMT25QL01GBBB8E12-0AUT
Product classSerial NOR Flash MemorySerial NOR Flash Memory
Density1Gb1Gb
Voltage3.0 V3.0 V
Catalog widthx4x4
InterfaceSPISPI
Package familyTBGATBGA
Package dimensions6.00 mm x 8.00 mm x 1.20 mm6.00 mm x 8.00 mm x 1.20 mm
Operating temperature-40°C to +105°C-40°C to +125°C
Micron catalog statusProductionContact Sales
OrganizationComponentComponent
Depth256Mb x4256Mb x4
Die count22

Key differences

-0AUT extends the documented operating ceiling to +125°C

Micron lists -40°C to +125°C for MT25QL01GBBB8E12-0AUT and -40°C to +105°C for MT25QL01GBBB8E12-0AAT. Select the exact grade from the qualified ambient, junction-temperature and derating analysis; the wider catalog range does not waive board-level thermal validation.

The current Micron catalog exposes different sourcing states

MT25QL01GBBB8E12-0AAT is listed as Production, while MT25QL01GBBB8E12-0AUT is listed as Contact Sales. Treat Contact Sales as a requirement to confirm orderability, lead time and lifecycle directly rather than as a guaranteed production commitment.

Can these parts be interchanged?

MT25QL01GBBB8E12-0AAT and MT25QL01GBBB8E12-0AUT share the Micron MT25QL 1Gb, 3.0V, x4 SPI Serial NOR identity and the same listed TBGA dimensions, so they are plausible same-footprint review candidates. They are not automatically interchangeable: the temperature suffix and current catalog status differ. Before substitution, compare the revision-controlled datasheet, ball map, command set, timing mode, boot-ROM support, qualification requirements, packing code and current factory orderability for the complete MPN, then requalify the board across voltage and temperature.

Replacement verification checklist
  • Electrical ratings and operating conditions
  • Package dimensions, footprint and pinout
  • Interface, timing and firmware behavior
  • Temperature and qualification grade
  • Lifecycle status and current documentation revision

MT25QL01GBBB8E12-0AAT vs MT25QL01GBBB8E12-0AUT FAQ

What is the main difference between MT25QL01GBBB8E12-0AAT and MT25QL01GBBB8E12-0AUT?

The most direct selection difference is operating grade. Micron lists -0AAT for -40°C to +105°C and -0AUT for -40°C to +125°C. The catalog also shows different current status fields, so approve the full order code rather than treating the suffixes as interchangeable.

Which part supports the higher operating-temperature ceiling?

MT25QL01GBBB8E12-0AUT has the higher listed ceiling at +125°C. MT25QL01GBBB8E12-0AAT is listed to +105°C. Confirm system derating, thermal conditions and the controlling Micron documentation before approving either limit.

Do MT25QL01GBBB8E12-0AAT and -0AUT use the same package?

Micron lists both as TBGA devices with 6.00 mm x 8.00 mm x 1.20 mm dimensions. Matching package dimensions alone do not prove drop-in compatibility; verify the ball map, package drawing, packing code and board qualification for the exact MPN.

Can -0AAT replace -0AUT?

Do not assume it can. The -0AAT temperature ceiling is 20°C lower, and the current Micron catalog status differs. A replacement requires a thermal-margin review, timing and protocol checks, exact package confirmation and board-level requalification.

What does Contact Sales mean for MT25QL01GBBB8E12-0AUT?

Contact Sales means the catalog does not present the same Production status shown for -0AAT. Confirm current orderability, lifecycle, minimum quantities, lead time and documentation directly for the complete -0AUT order code before committing it to a new design or sourcing plan.

Sources and verification

This comparison supports preliminary selection and sourcing review. Similar specifications do not establish drop-in compatibility. Confirm the complete orderable code and current manufacturer documentation before design release or purchase.

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