FEMDNN064G-A3A56
64 GB industrial embedded MultiMediaCard with eMMC 5.1 interface and 3D TLC NAND
Key details
| Part Number | FEMDNN064G-A3A56 |
|---|---|
| Manufacturer | FORESEE (Longsys) |
| Category | eMMC Managed NAND |
| Lifecycle Status | Production |
| Series | FORESEE Industrial eMMC |
| Package / Case | 153-ball FBGA, 11.5 mm × 13 mm × 0.8 mm |
| Pin Count | 153 |
| Operating Temperature | -25°C to +85°C |
| Last Verified | 2026-07-20 |
Part information
FEMDNN064G-A3A56 Overview
FEMDNN064G-A3A56 is a FORESEE (Longsys) 64 GB industrial embedded MultiMediaCard with eMMC 5.1 interface and 3D TLC NAND supplied in 153-ball FBGA, 11.5 mm × 13 mm × 0.8 mm. This page uses the exact orderable code because package, grade, temperature and option suffixes can change compatibility.
Key Technical Specifications
| Capacity | 64 GB |
|---|---|
| Interface | eMMC 5.1, HS400 |
| NAND Type | 3D TLC |
| I/O Voltage | 1.8 V or 3.3 V |
| Product Grade | Industrial / wide-temperature embedded storage |
Package and Ordering Notes
The listed package is 153-ball FBGA, 11.5 mm × 13 mm × 0.8 mm with 153 pins, leads, lands or contacts. The featured image is a generic package illustration for form-factor identification and is not an actual date-code or lot photograph. The part or family is listed by FORESEE (Longsys) as Production at the verification date.
Sourcing Guidance
Confirm current factory lead time, packing format and revision for FEMDNN064G-A3A56 before placing the order.
For an accurate quotation, include the full MPN, target quantity, acceptable date-code range, packaging format and destination. Icearth can help review traceability documents, label photos and electrical/package alignment before order placement.
Manufacturer Documentation
Technical values were checked against FORESEE (Longsys) documentation. Use the linked datasheet as the controlling source and re-check revisions before PCB release or firmware qualification.
How FEMDNN064G-A3A56 differs from related orderable parts
FEMDNN064G-A3A56 belongs to the FORESEE Industrial eMMC family. Compared with FEMDNN032G-A3A55, the recorded differences include functional description: 64 GB industrial embedded MultiMediaCard with eMMC 5.1 interface and 3D TLC NAND versus 32 GB industrial embedded MultiMediaCard with eMMC 5.1 interface and 3D TLC NAND and Capacity: 64 GB, a higher recorded value than 32 GB. A shared family name does not establish pin, firmware or qualification compatibility.
| Part number | Recorded function | Package | Pins / contacts | Temperature | Lifecycle |
|---|---|---|---|---|---|
| FEMDNN064G-A3A56 | 64 GB industrial embedded MultiMediaCard with eMMC 5.1 interface and 3D TLC NAND | 153-ball FBGA, 11.5 mm × 13 mm × 0.8 mm | 153 pins, leads or contacts | -25°C to +85°C | Production |
| FEMDNN032G-A3A55 | 32 GB industrial embedded MultiMediaCard with eMMC 5.1 interface and 3D TLC NAND | 153-ball FBGA, 11.5 mm × 13 mm × 0.8 mm | 153 pins, leads or contacts | -25°C to +85°C | Production |
For an RFQ or AVL review, quote the complete FEMDNN064G-A3A56 code and verify the manufacturer ordering table, package drawing, packing method and revision. The related numbers above are comparison references, not declared drop-in replacements.
Lifecycle and sourcing review
Lifecycle information is shown for reference. Confirm current manufacturer documentation, availability and technical suitability before purchase.
Confirm current factory lead time, packing format and revision for FEMDNN064G-A3A56 before placing the order.