MTFC256GAVATTC-AAT
256GB UFS TLC 256Gb x8 component
Key details
| Part Number | MTFC256GAVATTC-AAT |
|---|---|
| Manufacturer | Micron Technology |
| Category | UFS Managed NAND |
| Lifecycle Status | End of Life |
| Series | Micron UFS TLC MCP |
| Package / Case | 153-ball LFBGA, 11.50 x 13.00 x 1.30 mm |
| Pin Count | 153 |
| Operating Temperature | -40C to +105C |
| Last Verified | 2026-08-12 |
Part information
MTFC256GAVATTC-AAT Overview
MTFC256GAVATTC-AAT is a Micron Technology 256GB UFS TLC 256Gb x8 component supplied in 153-ball LFBGA, 11.50 x 13.00 x 1.30 mm. This page preserves the exact displayed MPN because package, grade, temperature and option suffixes can change compatibility.
Key Technical Specifications
| Verified Ordering Code | MTFC256GAVATTC-AAT |
|---|---|
| Density | 256GB |
| Technology | UFS TLC |
| Family | MCP |
| Component Configuration | 256Gb x8 |
| Package | LFBGA |
| Pin / Ball Count | 153-ball |
| Package Dimensions | 11.50 x 13.00 x 1.30 mm |
| Dry Pack Quantity | 1520 |
| Tape and Reel Quantity | 2000 |
Package and Ordering Notes
The listed package is 153-ball LFBGA, 11.50 x 13.00 x 1.30 mm with 153 pins, leads, lands or contacts. The featured image is a generic package illustration for form-factor identification and is not an actual date-code or lot photograph. Lifecycle is recorded as End of Life; confirm current factory support and last-time-buy constraints before design-in.
Sourcing Guidance
MTFC256GAVATTC-AAT is the exact Micron ordering identity. Confirm End of Life lifecycle, -40C to +105C grade, 153-ball LFBGA, 11.50 x 13.00 x 1.30 mm, packing and the linked data-sheet revision before ordering.
For an accurate quotation, include the full MPN, target quantity, acceptable date-code range, packaging format and destination. Icearth can help review traceability documents, label photos and electrical/package alignment before order placement.
Documentation and Source Status
Technical values were checked against Micron Technology documentation. Use the linked datasheet as the controlling source and re-check revisions before PCB release or firmware qualification.
Related Product Resources
Browse the Micron Technology product archive or the UFS Managed NAND category for precisely classified internal resources. Related family codes are not presented as substitutes unless the manufacturer explicitly identifies them.
MTFC256GAVATTC-AAT FAQ
What is MTFC256GAVATTC-AAT?
MTFC256GAVATTC-AAT is the exact Micron ordering code for a 256GB UFS TLC device in the Micron UFS TLC MCP series. Identity was checked against the linked Micron part-detail record.
What are the key specifications of MTFC256GAVATTC-AAT?
Micron lists 256GB, and -40C to +105C for MTFC256GAVATTC-AAT. Use the linked official data sheet for revision-controlled limits.
What package does MTFC256GAVATTC-AAT use?
MTFC256GAVATTC-AAT uses a 153-ball LFBGA package measuring 11.50 x 13.00 x 1.30 mm. Verify the official package drawing before PCB release.
What is the lifecycle status of MTFC256GAVATTC-AAT?
Micron lists this exact ordering code as End of Life; it is not represented as a Production part. This was checked in Micron’s live current or official obsolete catalog on 2026-08-12; recheck factory support before design-in or procurement.
What should be checked before sourcing MTFC256GAVATTC-AAT?
Quote MTFC256GAVATTC-AAT exactly and verify the -40C to +105C grade, LFBGA package and 153-ball, electrical interface, packing, label traceability, and controlling Micron data-sheet revision. Do not substitute a neighboring suffix without separate qualification.
Lifecycle and sourcing review
This part has a legacy lifecycle status. Submit the exact MPN, quantity, delivery destination and date-code requirements for a sourcing review.
MTFC256GAVATTC-AAT is the exact Micron ordering identity. Confirm End of Life lifecycle, -40C to +105C grade, 153-ball LFBGA, 11.50 x 13.00 x 1.30 mm, packing and the linked data-sheet revision before ordering.