MTFC32GAPALBH-AIT
256Gb 3.3 VOLTS eMMC MLC 32Gb x8 MCP component
Key details
| Part Number | MTFC32GAPALBH-AIT |
|---|---|
| Manufacturer | Micron Technology |
| Category | eMMC Managed NAND |
| Lifecycle Status | Obsolete |
| Series | Micron eMMC MLC MCP |
| Package / Case | 153-ball TFBGA, 11.50 x 13.00 x 1.10 mm |
| Pin Count | 153 |
| Operating Temperature | -40C to +85C |
| Last Verified | 2026-08-11 |
Part information
MTFC32GAPALBH-AIT Overview
MTFC32GAPALBH-AIT is a Micron Technology 256Gb 3.3 VOLTS eMMC MLC 32Gb x8 MCP component supplied in 153-ball TFBGA, 11.50 x 13.00 x 1.10 mm. This page preserves the exact displayed MPN because package, grade, temperature and option suffixes can change compatibility.
Key Technical Specifications
| Verified Ordering Code | MTFC32GAPALBH-AIT |
|---|---|
| Capacity | 256Gb |
| Technology | eMMC MLC |
| Family | MCP |
| I/O Voltage | 3.3 VOLTS |
| Component Configuration | 32Gb x8 |
| Clock Speed | 200MHz |
| Transfer Rate | 400MTPS |
| Package | TFBGA |
| Pin / Ball Count | 153-ball |
| Package Dimensions | 11.50 x 13.00 x 1.10 mm |
| Number of Components | 1 |
| Dry Pack Quantity | 1520 |
| Tape and Reel Quantity | 1000 |
Package and Ordering Notes
The listed package is 153-ball TFBGA, 11.50 x 13.00 x 1.10 mm with 153 pins, leads, lands or contacts. The featured image is a generic package illustration for form-factor identification and is not an actual date-code or lot photograph. Lifecycle is recorded as Obsolete; confirm current factory support and last-time-buy constraints before design-in.
Sourcing Guidance
MTFC32GAPALBH-AIT is the exact ordering identity in Micron obsolete eMMC catalog. Confirm Obsolete lifecycle, -40C to +85C grade, 153-ball TFBGA, 11.50 x 13.00 x 1.10 mm, packing quantity and the linked Micron data-sheet revision before ordering.
For an accurate quotation, include the full MPN, target quantity, acceptable date-code range, packaging format and destination. Icearth can help review traceability documents, label photos and electrical/package alignment before order placement.
Documentation and Source Status
Technical values were checked against Micron Technology documentation. Use the linked datasheet as the controlling source and re-check revisions before PCB release or firmware qualification.
Related Product Resources
Browse the Micron Technology product archive or the eMMC Managed NAND category for precisely classified internal resources. Related family codes are not presented as substitutes unless the manufacturer explicitly identifies them.
MTFC32GAPALBH-AIT FAQ
What is MTFC32GAPALBH-AIT?
MTFC32GAPALBH-AIT is the exact Micron ordering code for a 256Gb eMMC MLC 32Gb x8 device in the Micron eMMC MLC MCP family. The identity was checked against the linked Micron part-detail record.
What are the key specifications of MTFC32GAPALBH-AIT?
Micron lists 256Gb capacity, 3.3 VOLTS, 32Gb x8, and -40C to +85C operating temperature for MTFC32GAPALBH-AIT. Use the linked official data sheet for revision-controlled limits.
What package does MTFC32GAPALBH-AIT use?
MTFC32GAPALBH-AIT uses a 153-ball TFBGA package measuring 11.50 x 13.00 x 1.10 mm. These values come from the exact Micron catalog record; verify the package drawing before PCB release.
What is the lifecycle status of MTFC32GAPALBH-AIT?
Micron lists this exact ordering code as Obsolete; it is not represented as a Production part. This status was checked in Micron’s live current or official obsolete catalog on 2026-08-11; recheck factory support before design-in or procurement.
What should be checked before sourcing MTFC32GAPALBH-AIT?
Quote MTFC32GAPALBH-AIT exactly and verify the -40C to +85C grade, TFBGA package and 153-ball, voltage, packing method, label traceability, and controlling Micron data-sheet revision. Do not substitute a neighboring suffix without a separate qualification.
Lifecycle and sourcing review
This part has a legacy lifecycle status. Submit the exact MPN, quantity, delivery destination and date-code requirements for a sourcing review.
MTFC32GAPALBH-AIT is the exact ordering identity in Micron obsolete eMMC catalog. Confirm Obsolete lifecycle, -40C to +85C grade, 153-ball TFBGA, 11.50 x 13.00 x 1.10 mm, packing quantity and the linked Micron data-sheet revision before ordering.