Get Marketing Insights First
Subscribe to receive actionable strategies, growth tips, and industry insights delivered straight to your inbox.
MX25U12843GBBI00
128Mb 1.8V high-performance SPI multi-I/O NOR Flash
Specifications
Key details
| Part Number | MX25U12843GBBI00 |
|---|---|
| Manufacturer | Macronix |
| Category | Serial NOR Flash |
| Lifecycle Status | Production |
| Series | MX25U12843G |
| Package / Case | 16-ball WLCSP |
| Pin Count | 16 |
| Operating Temperature | -40°C to +85°C (Industrial) |
| Last Verified | 2026-07-17 |
Overview
Part information
MX25U12843GBBI00 Overview
MX25U12843GBBI00 is a Macronix 128Mb 1.8V high-performance SPI multi-I/O NOR Flash supplied in 16-ball WLCSP. This page uses the exact orderable code because package, speed, temperature and option suffixes can change compatibility.
Key Technical Specifications
| Memory Density | 128Mb |
|---|---|
| Interface | SPI / Dual / Quad I/O / QPI |
| Supply Voltage | 1.65V to 2.0V |
| Maximum Clock | 133MHz |
| Features | DTR read, XIP, SFDP, advanced protection |
| Model Code | 00, STR with x1 I/O enabled |
| Package | 16-ball WLCSP, 0.30mm balls |
| Temperature Grade | Industrial, -40°C to +85°C |
Package and Ordering Notes
The listed package is 16-ball WLCSP with 16 pins/lands/balls. The featured image is a generic package illustration for form-factor identification and is not an actual date-code or lot photograph. The family is listed by Macronix as Production at the verification date.
Sourcing Guidance
The BB code is a 16-ball WLCSP with 0.30mm ball diameter. Confirm the wafer-level package drawing, ball map, underfill/reflow process and model code 00 before design release.
For an accurate quotation, include the full MPN, target quantity, acceptable date-code range, packaging format and destination. Icearth can help review traceability documents, label photos and electrical/package alignment before order placement.
Manufacturer Documentation
Technical values were checked against Macronix documentation. Use the linked datasheet as the controlling source and re-check revisions before PCB release or firmware qualification.
Sourcing notes
Lifecycle and sourcing review
Production
Lifecycle information is shown for reference. Confirm current manufacturer documentation, availability and technical suitability before purchase.
The BB code is a 16-ball WLCSP with 0.30mm ball diameter. Confirm the wafer-level package drawing, ball map, underfill/reflow process and model code 00 before design release.