
THGBMHG6C1LBAIL
8 GB embedded managed NAND flash memory compliant with eMMC 5.1
Key details
| Part Number | THGBMHG6C1LBAIL |
|---|---|
| Manufacturer | Kioxia (Toshiba Memory legacy) |
| Category | eMMC Managed NAND |
| Lifecycle Status | Obsolete |
| Series | THGBMHG |
| Package / Case | 11.5 mm x 13 mm x 0.8 mm FBGA |
| Pin Count | 153 |
| Operating Temperature | -25 C to +85 C consumer class; confirm suffix |
| Last Verified | 2026-07-24 |
Part information
THGBMHG6C1LBAIL Overview
THGBMHG6C1LBAIL is a Kioxia (Toshiba Memory legacy) 8 GB embedded managed NAND flash memory compliant with eMMC 5.1 supplied in 11.5 mm x 13 mm x 0.8 mm FBGA. This page uses the exact orderable code because package, grade, temperature and option suffixes can change compatibility.
Key Technical Specifications
| Capacity | 8 GB |
|---|---|
| Interface | JEDEC eMMC 5.1 |
| Package Size | 11.5 mm x 13 mm x 0.8 mm |
| Supply | 2.7 V to 3.6 V VCC; dual-voltage VCCQ support varies |
| Managed Functions | Integrated controller, ECC and block management |
Package and Ordering Notes
The listed package is 11.5 mm x 13 mm x 0.8 mm FBGA with 153 pins, leads, lands or contacts. The featured image is a generic package illustration for form-factor identification and is not an actual date-code or lot photograph. Lifecycle is recorded as Obsolete; confirm current factory support and last-time-buy constraints before design-in.
Sourcing Guidance
THGBMHG6C1LBAIL is obsolete or discontinued. Require traceability, date-code, package-marking and storage-condition checks for remaining stock.
For an accurate quotation, include the full MPN, target quantity, acceptable date-code range, packaging format and destination. Icearth can help review traceability documents, label photos and electrical/package alignment before order placement.
Manufacturer Documentation
Technical values were checked against Kioxia (Toshiba Memory legacy) documentation. Use the linked datasheet as the controlling source and re-check revisions before PCB release or firmware qualification.
THGBMHG6C1LBAIL FAQ
What is THGBMHG6C1LBAIL?
THGBMHG6C1LBAIL is a Kioxia (Toshiba Memory legacy) 8 GB embedded managed NAND flash memory compliant with eMMC 5.1. It belongs to the THGBMHG series.
What are the key specifications of THGBMHG6C1LBAIL?
Capacity is 8 GB, and Interface is JEDEC eMMC 5.1. Refer to the manufacturer datasheet for limits, test conditions and revision-controlled values.
What package does THGBMHG6C1LBAIL use?
THGBMHG6C1LBAIL is supplied in 11.5 mm x 13 mm x 0.8 mm FBGA with 153 pins, leads, balls or contacts. Verify the exact footprint and ordering suffix before PCB release.
Is THGBMHG6C1LBAIL still in production?
THGBMHG6C1LBAIL is obsolete or discontinued. Remaining stock should be checked for traceability, date code, package marking and storage history.
What should be checked before sourcing THGBMHG6C1LBAIL?
Confirm the complete MPN, electrical ratings, package, temperature grade and required quantity. Possible alternatives include Select a current Kioxia eMMC after verifying capacity, eMMC revision, voltage, package height, ball map and firmware behavior, but compatibility must be verified independently.
How THGBMHG6C1LBAIL differs from related orderable parts
THGBMHG6C1LBAIL belongs to the THGBMHG family. Compared with THGBMHG9C4LBAIR, the recorded differences include functional description: 8 GB embedded managed NAND flash memory compliant with eMMC 5.1 versus 64 GB embedded managed NAND flash memory compliant with eMMC 5.1; package: 11.5 mm x 13 mm x 0.8 mm FBGA versus 11.5 mm x 13 mm x 1.0 mm FBGA; Capacity: 8 GB, a lower recorded value than 64 GB; and Package Size: 11.5 mm x 13 mm x 0.8 mm rather than 11.5 mm x 13 mm x 1.0 mm. A shared family name does not establish pin, firmware or qualification compatibility.
| Part number | Recorded function | Package | Pins / contacts | Temperature | Lifecycle |
|---|---|---|---|---|---|
| THGBMHG6C1LBAIL | 8 GB embedded managed NAND flash memory compliant with eMMC 5.1 | 11.5 mm x 13 mm x 0.8 mm FBGA | 153 pins, leads or contacts | -25 C to +85 C consumer class; confirm suffix | Obsolete |
| THGBMHG9C4LBAIR | 64 GB embedded managed NAND flash memory compliant with eMMC 5.1 | 11.5 mm x 13 mm x 1.0 mm FBGA | 153 pins, leads or contacts | -25 C to +85 C consumer class; confirm suffix | Obsolete |
| THGBMHG8C4LBAIR | 32 GB embedded managed NAND flash memory compliant with eMMC 5.1 | 11.5 mm x 13 mm x 1.0 mm FBGA | 153 pins, leads or contacts | -25 C to +85 C consumer class; confirm suffix | Obsolete |
| THGBMFG6C1LBAIL | 8 GB embedded managed NAND flash memory compliant with eMMC 5.0 | 11.5 mm x 13 mm x 0.8 mm FBGA | 153 pins, leads or contacts | -25 C to +85 C consumer class; confirm suffix | Obsolete |
For an RFQ or AVL review, quote the complete THGBMHG6C1LBAIL code and verify the manufacturer ordering table, package drawing, packing method and revision. The related numbers above are comparison references, not declared drop-in replacements.
Exact order-code identity for THGBMHG6C1LBAIL
For BOM, label, AVL and RFQ matching, preserve these visible code segments: opening alphabetic sequence THGBMHG; middle numeric sequence six; middle alphabetic sequence C; middle numeric sequence one; and terminal alphabetic sequence LBAIL. The nearest published comparison codes are THGBMHG9C4LBAIR; THGBMHG8C4LBAIR; and THGBMFG6C1LBAIL. Compare every segment because a changed character can identify a different density, voltage, package, temperature, qualification or packing option.
Do not shorten the requested code to THGBMHG or remove its terminal characters. Ask the supplier to reproduce the complete code on the quotation and provide label or traceability evidence when exact suffix matching is mandatory.
Lifecycle and sourcing review
This part has a legacy lifecycle status. Submit the exact MPN, quantity, delivery destination and date-code requirements for a sourcing review.
THGBMHG6C1LBAIL is obsolete or discontinued. Require traceability, date-code, package-marking and storage-condition checks for remaining stock.
Potential alternative part numbers
Verify package, pinout, voltage, firmware behavior and qualification before substitution.