DS1307+ vs DS1337+

Component comparison · Last verified 2026-07-27

Choose DS1307+ when a 5 V design needs automatic switchover to a dedicated backup battery and 56 bytes of battery-backed SRAM. Choose DS1337+ when a wider main-supply range, 400 kHz I2C and two programmable alarms matter more. Both use external crystals and 8-pin PDIP packages, but their supply architecture, pinout and feature maps are not interchangeable.

DS1307+ vs DS1337+ specifications

SpecificationDS1307+DS1337+
Serial interfaceI2C up to 100 kHzI2C up to 400 kHz
Main supply range4.5 V to 5.5 V1.8 V to 5.5 V for accessible operation
Backup architectureDedicated VBAT input with automatic switchoverNo dedicated VBAT input; timekeeping continues as VCC falls to 1.3 V
User SRAM56 bytes, battery backedNone
Time-of-day alarmsNoneTwo
Square-wave output1 Hz, 4.096 kHz, 8.192 kHz or 32.768 kHzProgrammable square wave with interrupt sharing
TimebaseExternal 32.768 kHz crystalExternal 32.768 kHz crystal
Crystal load capacitance12.5 pF6 pF
Package / case8-pin narrow PDIP, 300 mil8-pin narrow PDIP, 300 mil
RTC I2C address1101000b (0x68)1101000b (0x68)

Key differences

Backup power and retained memory are fundamentally different

DS1307+ has a dedicated VBAT pin, automatic supply switchover and 56 bytes of backed-up SRAM. DS1337+ has no dedicated battery input or user SRAM; its timekeeping circuit remains active while VCC falls to the specified lower timekeeping voltage.

DS1337+ adds alarms and a faster I2C limit

DS1337+ supports two time-of-day alarms and I2C fast mode up to 400 kHz. DS1307+ has no alarm registers and its SCL specification is limited to 100 kHz, although it does provide a selectable square-wave output.

The identical package outline does not mean identical pins

Both orderable codes use an 8-pin narrow PDIP, but pin 3 is VBAT on DS1307+ and an alarm interrupt output on DS1337+. Their crystal loading, control registers and power-fail behavior also differ.

Can these parts be interchanged?

DS1307+ and DS1337+ are not drop-in replacements even though both use an 8-pin narrow PDIP and the same I2C address. Pin 3, supply behavior, crystal load requirement, register map, alarm functions and retained-memory support differ. Review the schematic, crystal network, backup source, firmware, startup behavior and required bus speed before changing the BOM.

Replacement verification checklist
  • Electrical ratings and operating conditions
  • Package dimensions, footprint and pinout
  • Interface, timing and firmware behavior
  • Temperature and qualification grade
  • Lifecycle status and current documentation revision

DS1307+ vs DS1337+ FAQ

What is the main difference between DS1307+ and DS1337+?

DS1307+ emphasizes automatic battery switchover and 56 bytes of battery-backed SRAM. DS1337+ instead provides two alarms, faster 400 kHz I2C and a wider accessible main-supply range, but no dedicated VBAT input or user SRAM.

Can DS1337+ directly replace DS1307+ in an 8-pin socket?

No. The package outline and I2C address match, but pin 3 has a different function and the power, crystal and register architectures differ. A board and firmware redesign is normally required.

Which part is better for a design that must retain small configuration data?

DS1307+ is the relevant option when the application needs its 56 bytes of battery-backed SRAM. DS1337+ does not provide user SRAM, so retained application data needs another memory device.

Which device supports programmable alarms?

DS1337+ provides two time-of-day alarms. DS1307+ has no alarm registers, although it can generate selectable square-wave frequencies from its SQW/OUT pin.

Do DS1307+ and DS1337+ use the same external crystal?

Both use a 32.768 kHz external crystal, but the specified load capacitance differs: 12.5 pF for DS1307+ and 6 pF for DS1337+. Recheck the crystal and PCB layout when changing devices.

Sources and verification

This comparison supports preliminary selection and sourcing review. Similar specifications do not establish drop-in compatibility. Confirm the complete orderable code and current manufacturer documentation before design release or purchase.

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