H9TQ17ABJTMCUR-KUM
16 GB eMMC and 16 Gb LPDDR3 combined memory for legacy mobile platforms
Key details
| Part Number | H9TQ17ABJTMCUR-KUM |
|---|---|
| Manufacturer | SK hynix |
| Category | eMCP Memory |
| Lifecycle Status | Obsolete |
| Series | eMCP |
| Package / Case | 221-ball FBGA |
| Pin Count | 221 |
| Operating Temperature | -25°C to +85°C |
| Last Verified | 2026-07-21 |
Part information
H9TQ17ABJTMCUR-KUM Overview
H9TQ17ABJTMCUR-KUM is a SK hynix 16 GB eMMC and 16 Gb LPDDR3 combined memory for legacy mobile platforms supplied in 221-ball FBGA. This page uses the exact orderable code because package, grade, temperature and option suffixes can change compatibility.
Key Technical Specifications
| Managed NAND | 16 GB eMMC |
|---|---|
| Mobile DRAM | 16 Gb LPDDR3 |
| DRAM Data Rate | Up to 1866 MT/s |
| Integration | eMMC and LPDDR3 in one package |
| Application | Legacy mobile platforms |
Package and Ordering Notes
The listed package is 221-ball FBGA with 221 pins, leads, lands or contacts. The featured image is a generic package illustration for form-factor identification and is not an actual date-code or lot photograph. Lifecycle is recorded as Obsolete; confirm current factory support and last-time-buy constraints before design-in.
Sourcing Guidance
H9TQ17ABJTMCUR-KUM is obsolete or discontinued. Require date-code, label, package and traceability checks, and validate any replacement independently.
For an accurate quotation, include the full MPN, target quantity, acceptable date-code range, packaging format and destination. Icearth can help review traceability documents, label photos and electrical/package alignment before order placement.
Manufacturer Documentation
Technical values were checked against SK hynix documentation. Use the linked datasheet as the controlling source and re-check revisions before PCB release or firmware qualification.
H9TQ17ABJTMCUR-KUM selection and design context
H9TQ17ABJTMCUR-KUM is cataloged as a eMCP Memory in the eMCP family. Its recorded function is 16 GB eMMC and 16 Gb LPDDR3 combined memory for legacy mobile platforms. Selection should be based on the complete electrical limits, package drawing and ordering suffix rather than the abbreviated family code.
- Managed NAND: 16 GB eMMC. Confirm the value and its datasheet test conditions for the exact ordering suffix.
- Mobile DRAM: 16 Gb LPDDR3. Confirm the value and its datasheet test conditions for the exact ordering suffix.
- DRAM Data Rate: Up to 1866 MT/s. Confirm system timing margin and the test conditions attached to the published limit.
- Integration: eMMC and LPDDR3 in one package. Confirm the value and its datasheet test conditions for the exact ordering suffix.
Application and qualification considerations
When evaluating this memory device, confirm density, organization, interface mode, supply rails, access or clock timing, erase endurance and software command compatibility. For a new design, review power-up behavior, interface timing, absolute maximum ratings, thermal limits and any external-component requirements in the latest manufacturer documentation. Existing-board replacement work should additionally confirm pinout, footprint, firmware assumptions and qualification grade.
Procurement checks for H9TQ17ABJTMCUR-KUM
The recorded package is 221-ball FBGA, the temperature range is -25°C to +85°C, and the lifecycle status is Obsolete as of 2026-07-21. Before ordering, confirm the exact MPN on the label, packing format, quantity, date-code requirements, traceability documents and current factory status.
H9TQ17ABJTMCUR-KUM FAQ
What distinguishes H9TQ17ABJTMCUR-KUM within the eMCP family?
H9TQ17ABJTMCUR-KUM is the exact orderable code for a 16 GB eMMC and 16 Gb LPDDR3 combined memory for legacy mobile platforms in 221-ball FBGA. Related eMCP devices may change package, rating, interface option or qualification grade, so compare the manufacturer ordering table before substitution.
What package and footprint checks are required for H9TQ17ABJTMCUR-KUM?
H9TQ17ABJTMCUR-KUM is recorded in 221-ball FBGA with 221 pins, leads or contacts. Confirm the manufacturer package drawing, dimensions, pin numbering, exposed-pad requirements and packing suffix before releasing a PCB footprint.
Which specifications should be verified when selecting H9TQ17ABJTMCUR-KUM?
Managed NAND is recorded as 16 GB eMMC, Mobile DRAM is recorded as 16 Gb LPDDR3. Use the latest datasheet for minimum and maximum limits, test conditions, timing and absolute maximum ratings rather than relying only on a distributor summary.
What is the lifecycle status of H9TQ17ABJTMCUR-KUM?
H9TQ17ABJTMCUR-KUM was recorded as Obsolete when verified on 2026-07-21. Reconfirm factory status, revision availability, lead time and any last-time-buy notice before design-in or volume procurement.
What information should be included in an RFQ for H9TQ17ABJTMCUR-KUM?
Provide the complete H9TQ17ABJTMCUR-KUM orderable code, target quantity, acceptable date-code range, required packing method, delivery destination and documentation needs. For replacement work, also identify the existing package and any mandatory qualification grade.
Lifecycle and sourcing review
This part has a legacy lifecycle status. Submit the exact MPN, quantity, delivery destination and date-code requirements for a sourcing review.
H9TQ17ABJTMCUR-KUM is obsolete or discontinued. Require date-code, label, package and traceability checks, and validate any replacement independently.
Potential alternative part numbers
Verify package, pinout, voltage, firmware behavior and qualification before substitution.