
H9TQ64A8GTMCUR-KUM
8 GB eMMC and 8 Gb LPDDR3 combined memory for legacy mobile platforms
Key details
| Part Number | H9TQ64A8GTMCUR-KUM |
|---|---|
| Manufacturer | SK hynix |
| Category | eMCP Memory |
| Lifecycle Status | Obsolete |
| Series | eMCP |
| Package / Case | 221-ball FBGA |
| Pin Count | 221 |
| Operating Temperature | -25°C to +85°C |
| Last Verified | 2026-07-21 |
Part information
H9TQ64A8GTMCUR-KUM Overview
H9TQ64A8GTMCUR-KUM is a SK hynix 8 GB eMMC and 8 Gb LPDDR3 combined memory for legacy mobile platforms supplied in 221-ball FBGA. This page uses the exact orderable code because package, grade, temperature and option suffixes can change compatibility.
Key Technical Specifications
| Managed NAND | 8 GB eMMC 5.1 |
|---|---|
| Mobile DRAM | 8 Gb LPDDR3 |
| DRAM Data Rate | Up to 1866 MT/s |
| Integration | eMMC and LPDDR3 in one package |
| Application | Legacy mobile platforms |
Package and Ordering Notes
The listed package is 221-ball FBGA with 221 pins, leads, lands or contacts. The featured image is a generic package illustration for form-factor identification and is not an actual date-code or lot photograph. Lifecycle is recorded as Obsolete; confirm current factory support and last-time-buy constraints before design-in.
Sourcing Guidance
H9TQ64A8GTMCUR-KUM is obsolete or discontinued. Require date-code, label, package and traceability checks, and validate any replacement independently.
For an accurate quotation, include the full MPN, target quantity, acceptable date-code range, packaging format and destination. Icearth can help review traceability documents, label photos and electrical/package alignment before order placement.
Manufacturer Documentation
Technical values were checked against SK hynix documentation. Use the linked datasheet as the controlling source and re-check revisions before PCB release or firmware qualification.
How H9TQ64A8GTMCUR-KUM differs from related orderable parts
H9TQ64A8GTMCUR-KUM belongs to the eMCP family. The current catalog records for H9TQ64A8GTMCUR-KUM and H9TQ64A8GTDCUR-KUM share the same high-level functional, package and temperature profile. Their distinct manufacturer ordering codes must therefore be checked against the ordering-information table in the controlling datasheet before substitution. A shared family name does not establish pin, firmware or qualification compatibility.
| Part number | Recorded function | Package | Pins / contacts | Temperature | Lifecycle |
|---|---|---|---|---|---|
| H9TQ64A8GTMCUR-KUM | 8 GB eMMC and 8 Gb LPDDR3 combined memory for legacy mobile platforms | 221-ball FBGA | 221 pins, leads or contacts | -25°C to +85°C | Obsolete |
| H9TQ64A8GTDCUR-KUM | 8 GB eMMC and 8 Gb LPDDR3 combined memory for legacy mobile platforms | 221-ball FBGA | 221 pins, leads or contacts | -25°C to +85°C | Obsolete |
| H9TQ17ABJTMCUR-KUM | 16 GB eMMC and 16 Gb LPDDR3 combined memory for legacy mobile platforms | 221-ball FBGA | 221 pins, leads or contacts | -25°C to +85°C | Obsolete |
| H9TP32A4GDDCPR-KGM | 32 GB eMMC and 16 Gb LPDDR3 combined memory for legacy mobile platforms | 221-ball FBGA | 221 pins, leads or contacts | -25°C to +85°C | Obsolete |
For an RFQ or AVL review, quote the complete H9TQ64A8GTMCUR-KUM code and verify the manufacturer ordering table, package drawing, packing method and revision. The related numbers above are comparison references, not declared drop-in replacements.
Exact order-code identity for H9TQ64A8GTMCUR-KUM
For BOM, label, AVL and RFQ matching, preserve these visible code segments: opening alphabetic sequence H; middle numeric sequence nine; middle alphabetic sequence TQ; middle numeric sequence six four; middle alphabetic sequence A; middle numeric sequence eight; middle alphabetic sequence GTMCUR; and terminal alphabetic sequence KUM. The nearest published comparison codes are H9TQ64A8GTDCUR-KUM; H9TQ17ABJTMCUR-KUM; and H9TP32A4GDDCPR-KGM. Compare every segment because a changed character can identify a different density, voltage, package, temperature, qualification or packing option.
Do not shorten the requested code to eMCP or remove its terminal characters. Ask the supplier to reproduce the complete code on the quotation and provide label or traceability evidence when exact suffix matching is mandatory.
H9TQ64A8GTMCUR-KUM specification interpretation
The following notes interpret the recorded values for this exact orderable code. They are intended to make model-to-model differences visible during engineering and procurement review; the manufacturer datasheet remains the controlling source.
- Managed NAND: The recorded value is 8 GB eMMC 5.1, expressed in words as eight GB eMMC five point one. Confirm the value and its datasheet test conditions for the exact ordering suffix.
- Mobile DRAM: The recorded value is 8 Gb LPDDR3, expressed in words as eight Gb LPDDRthree. Confirm the value and its datasheet test conditions for the exact ordering suffix.
- DRAM Data Rate: The recorded value is Up to 1866 MT/s, expressed in words as Up to one thousand eight hundred sixty six MT/s. Confirm system timing margin and the test conditions attached to the published limit.
- Integration: The recorded value is eMMC and LPDDR3 in one package, expressed in words as eMMC and LPDDRthree in one package. Confirm the value and its datasheet test conditions for the exact ordering suffix.
- Application: The recorded value is Legacy mobile platforms. Confirm the value and its datasheet test conditions for the exact ordering suffix.
Choosing between H9TQ64A8GTMCUR-KUM and H9TQ64A8GTDCUR-KUM
The decision points below use the values recorded for these two exact orderable codes. Select H9TQ64A8GTMCUR-KUM when its stated value is the BOM requirement; select H9TQ64A8GTDCUR-KUM only when the alternate value has been independently approved.
The current Icearth records do not establish a high-level electrical difference between H9TQ64A8GTMCUR-KUM and H9TQ64A8GTDCUR-KUM. The confirmed distinction is the complete manufacturer ordering code. Do not infer that the codes are interchangeable; the unrecorded character change may identify a revision, packing option, qualification route or other ordering attribute.
If the assembly documentation names H9TQ64A8GTMCUR-KUM, require the quotation and supplied label to retain H9TQ64A8GTMCUR-KUM in full. A request for H9TQ64A8GTDCUR-KUM should be handled as a proposed substitution and reviewed for electrical, mechanical, firmware and qualification impact before approval.
Lifecycle and sourcing review
This part has a legacy lifecycle status. Submit the exact MPN, quantity, delivery destination and date-code requirements for a sourcing review.
H9TQ64A8GTMCUR-KUM is obsolete or discontinued. Require date-code, label, package and traceability checks, and validate any replacement independently.
Potential alternative part numbers
Verify package, pinout, voltage, firmware behavior and qualification before substitution.