MX25L12835FZNI-10G
128Mb 3V SPI multi-I/O NOR Flash
Key details
| Part Number | MX25L12835FZNI-10G |
|---|---|
| Manufacturer | Macronix |
| Category | Serial NOR Flash |
| Lifecycle Status | Production |
| Series | MX25L12835F |
| Package / Case | 8-WSON (6x5mm) |
| Pin Count | 8 |
| Operating Temperature | -40°C to +85°C (Industrial) |
| Last Verified | 2026-07-17 |
Part information
MX25L12835FZNI-10G Overview
MX25L12835FZNI-10G is a Macronix 128Mb 3V SPI multi-I/O NOR Flash supplied in 8-WSON (6x5mm). This page uses the exact orderable code because package, speed, temperature and option suffixes can change compatibility.
Key Technical Specifications
| Memory Density | 128Mb |
|---|---|
| Interface | SPI / Dual / Quad I/O / QPI |
| Supply Voltage | 2.7V to 3.6V |
| Maximum Clock | 104MHz (x1/x4); 84MHz (x2) |
| Features | Hardware reset, suspend/resume, unique ID |
| Package | 8-WSON, 6x5mm |
| Temperature Grade | Industrial, -40°C to +85°C |
Package and Ordering Notes
The listed package is 8-WSON (6x5mm) with 8 pins/lands/balls. The featured image is a generic package illustration for form-factor identification and is not an actual date-code or lot photograph. The family is listed by Macronix as Production at the verification date.
Sourcing Guidance
Confirm 3V operation, 6x5mm WSON dimensions and -10G speed/RoHS suffix. The 8x6mm Z2 package variant is not footprint interchangeable.
For an accurate quotation, include the full MPN, target quantity, acceptable date-code range, packaging format and destination. Icearth can help review traceability documents, label photos and electrical/package alignment before order placement.
Manufacturer Documentation
Technical values were checked against Macronix documentation. Use the linked datasheet as the controlling source and re-check revisions before PCB release or firmware qualification.
MX25L12835FZNI-10G selection and design context
MX25L12835FZNI-10G is cataloged as a Serial NOR Flash in the MX25L12835F family. Its recorded function is 128Mb 3V SPI multi-I/O NOR Flash. Selection should be based on the complete electrical limits, package drawing and ordering suffix rather than the abbreviated family code.
- Memory Density: 128Mb. Confirm address organization, software support and required usable capacity.
- Interface: SPI / Dual / Quad I/O / QPI. Confirm logic levels, signaling mode, host support and required external components.
- Supply Voltage: 2.7V to 3.6V. Check rail compatibility, tolerance and sequencing under worst-case conditions.
- Maximum Clock: 104MHz (x1/x4); 84MHz (x2). Confirm the value and its datasheet test conditions for the exact ordering suffix.
Application and qualification considerations
When evaluating this memory device, confirm density, organization, interface mode, supply rails, access or clock timing, erase endurance and software command compatibility. For a new design, review power-up behavior, interface timing, absolute maximum ratings, thermal limits and any external-component requirements in the latest manufacturer documentation. Existing-board replacement work should additionally confirm pinout, footprint, firmware assumptions and qualification grade.
Procurement checks for MX25L12835FZNI-10G
The recorded package is 8-WSON (6x5mm), the temperature range is -40°C to +85°C (Industrial), and the lifecycle status is Production as of 20260717. Before ordering, confirm the exact MPN on the label, packing format, quantity, date-code requirements, traceability documents and current factory status.
MX25L12835FZNI-10G FAQ
What distinguishes MX25L12835FZNI-10G within the MX25L12835F family?
MX25L12835FZNI-10G is the exact orderable code for a 128Mb 3V SPI multi-I/O NOR Flash in 8-WSON (6x5mm). Related MX25L12835F devices may change package, rating, interface option or qualification grade, so compare the manufacturer ordering table before substitution.
What package and footprint checks are required for MX25L12835FZNI-10G?
MX25L12835FZNI-10G is recorded in 8-WSON (6x5mm) with 8 pins, leads or contacts. Confirm the manufacturer package drawing, dimensions, pin numbering, exposed-pad requirements and packing suffix before releasing a PCB footprint.
Which specifications should be verified when selecting MX25L12835FZNI-10G?
Memory Density is recorded as 128Mb, Interface is recorded as SPI / Dual / Quad I/O / QPI. Use the latest datasheet for minimum and maximum limits, test conditions, timing and absolute maximum ratings rather than relying only on a distributor summary.
What is the lifecycle status of MX25L12835FZNI-10G?
MX25L12835FZNI-10G was recorded as Production when verified on 20260717. Reconfirm factory status, revision availability, lead time and any last-time-buy notice before design-in or volume procurement.
What information should be included in an RFQ for MX25L12835FZNI-10G?
Provide the complete MX25L12835FZNI-10G orderable code, target quantity, acceptable date-code range, required packing method, delivery destination and documentation needs. For replacement work, also identify the existing package and any mandatory qualification grade.
Lifecycle and sourcing review
Lifecycle information is shown for reference. Confirm current manufacturer documentation, availability and technical suitability before purchase.
Confirm 3V operation, 6x5mm WSON dimensions and -10G speed/RoHS suffix. The 8x6mm Z2 package variant is not footprint interchangeable.