MX29GL640EBTI-70G
64Mb 3V bottom-boot parallel NOR Flash with 70ns access
Key details
| Part Number | MX29GL640EBTI-70G |
|---|---|
| Manufacturer | Macronix |
| Category | Parallel NOR Flash |
| Lifecycle Status | Production |
| Series | MX29GL640E T/B |
| Package / Case | 48-TSOP (12x20mm) |
| Pin Count | 48 |
| Operating Temperature | -40°C to +85°C (Industrial) |
| Last Verified | 2026-07-17 |
Part information
MX29GL640EBTI-70G Overview
MX29GL640EBTI-70G is a Macronix 64Mb 3V bottom-boot parallel NOR Flash with 70ns access supplied in 48-TSOP (12x20mm). This page uses the exact orderable code because package, speed, temperature and option suffixes can change compatibility.
Key Technical Specifications
| Memory Density | 64Mb |
|---|---|
| Interface | Parallel NOR, x8/x16 |
| Supply Voltage | 2.7V to 3.6V |
| Access Time | 70ns |
| Sector Architecture | Bottom boot |
| Feature | Page read |
| Package | 48-TSOP, 12x20mm |
| Temperature Grade | Industrial, -40°C to +85°C |
Package and Ordering Notes
The listed package is 48-TSOP (12x20mm) with 48 pins/lands/balls. The featured image is a generic package illustration for form-factor identification and is not an actual date-code or lot photograph. The family is listed by Macronix as Production at the verification date.
Sourcing Guidance
The B code denotes bottom-boot architecture. Confirm boot-sector orientation, x8/x16 bus use and 48-TSOP footprint; top-boot parts are not drop-in equivalents at the memory-map level.
For an accurate quotation, include the full MPN, target quantity, acceptable date-code range, packaging format and destination. Icearth can help review traceability documents, label photos and electrical/package alignment before order placement.
Manufacturer Documentation
Technical values were checked against Macronix documentation. Use the linked datasheet as the controlling source and re-check revisions before PCB release or firmware qualification.
MX29GL640EBTI-70G selection and design context
MX29GL640EBTI-70G is cataloged as a Parallel NOR Flash in the MX29GL640E T/B family. Its recorded function is 64Mb 3V bottom-boot parallel NOR Flash with 70ns access. Selection should be based on the complete electrical limits, package drawing and ordering suffix rather than the abbreviated family code.
- Memory Density: 64Mb. Confirm address organization, software support and required usable capacity.
- Interface: Parallel NOR, x8/x16. Confirm logic levels, signaling mode, host support and required external components.
- Supply Voltage: 2.7V to 3.6V. Check rail compatibility, tolerance and sequencing under worst-case conditions.
- Access Time: 70ns. Confirm system timing margin and the test conditions attached to the published limit.
Application and qualification considerations
When evaluating this memory device, confirm density, organization, interface mode, supply rails, access or clock timing, erase endurance and software command compatibility. For a new design, review power-up behavior, interface timing, absolute maximum ratings, thermal limits and any external-component requirements in the latest manufacturer documentation. Existing-board replacement work should additionally confirm pinout, footprint, firmware assumptions and qualification grade.
Procurement checks for MX29GL640EBTI-70G
The recorded package is 48-TSOP (12x20mm), the temperature range is -40°C to +85°C (Industrial), and the lifecycle status is Production as of 2026-07-17. Before ordering, confirm the exact MPN on the label, packing format, quantity, date-code requirements, traceability documents and current factory status.
MX29GL640EBTI-70G FAQ
What distinguishes MX29GL640EBTI-70G within the MX29GL640E T/B family?
MX29GL640EBTI-70G is the exact orderable code for a 64Mb 3V bottom-boot parallel NOR Flash with 70ns access in 48-TSOP (12x20mm). Related MX29GL640E T/B devices may change package, rating, interface option or qualification grade, so compare the manufacturer ordering table before substitution.
What package and footprint checks are required for MX29GL640EBTI-70G?
MX29GL640EBTI-70G is recorded in 48-TSOP (12x20mm) with 48 pins, leads or contacts. Confirm the manufacturer package drawing, dimensions, pin numbering, exposed-pad requirements and packing suffix before releasing a PCB footprint.
Which specifications should be verified when selecting MX29GL640EBTI-70G?
Memory Density is recorded as 64Mb, Interface is recorded as Parallel NOR, x8/x16. Use the latest datasheet for minimum and maximum limits, test conditions, timing and absolute maximum ratings rather than relying only on a distributor summary.
What is the lifecycle status of MX29GL640EBTI-70G?
MX29GL640EBTI-70G was recorded as Production when verified on 2026-07-17. Reconfirm factory status, revision availability, lead time and any last-time-buy notice before design-in or volume procurement.
What information should be included in an RFQ for MX29GL640EBTI-70G?
Provide the complete MX29GL640EBTI-70G orderable code, target quantity, acceptable date-code range, required packing method, delivery destination and documentation needs. For replacement work, also identify the existing package and any mandatory qualification grade.
Lifecycle and sourcing review
Lifecycle information is shown for reference. Confirm current manufacturer documentation, availability and technical suitability before purchase.
The B code denotes bottom-boot architecture. Confirm boot-sector orientation, x8/x16 bus use and 48-TSOP footprint; top-boot parts are not drop-in equivalents at the memory-map level.