THGBMFG8C2LBAIL reference image
Reference image 153

THGBMFG8C2LBAIL

32 GB embedded managed NAND flash memory compliant with eMMC 5.0

Series
THGBMFG
Package
11.5 mm x 13 mm x 0.8 mm FBGA
Temperature
-25 C to +85 C consumer class; confirm suffix
Specifications

Key details

Part NumberTHGBMFG8C2LBAIL
ManufacturerKioxia (Toshiba Memory legacy)
CategoryeMMC Managed NAND
Lifecycle StatusObsolete
SeriesTHGBMFG
Package / Case11.5 mm x 13 mm x 0.8 mm FBGA
Pin Count153
Operating Temperature-25 C to +85 C consumer class; confirm suffix
Last Verified2026-07-24
Overview

Part information

THGBMFG8C2LBAIL Overview

THGBMFG8C2LBAIL is a Kioxia (Toshiba Memory legacy) 32 GB embedded managed NAND flash memory compliant with eMMC 5.0 supplied in 11.5 mm x 13 mm x 0.8 mm FBGA. This page uses the exact orderable code because package, grade, temperature and option suffixes can change compatibility.

Key Technical Specifications

Capacity32 GB
InterfaceJEDEC eMMC 5.0
Package Size11.5 mm x 13 mm x 0.8 mm
Supply2.7 V to 3.6 V VCC; dual-voltage VCCQ support varies
Managed FunctionsIntegrated controller, ECC and block management

Package and Ordering Notes

The listed package is 11.5 mm x 13 mm x 0.8 mm FBGA with 153 pins, leads, lands or contacts. The featured image is a generic package illustration for form-factor identification and is not an actual date-code or lot photograph. Lifecycle is recorded as Obsolete; confirm current factory support and last-time-buy constraints before design-in.

Sourcing Guidance

THGBMFG8C2LBAIL is obsolete or discontinued. Require traceability, date-code, package-marking and storage-condition checks for remaining stock.

For an accurate quotation, include the full MPN, target quantity, acceptable date-code range, packaging format and destination. Icearth can help review traceability documents, label photos and electrical/package alignment before order placement.

Manufacturer Documentation

Technical values were checked against Kioxia (Toshiba Memory legacy) documentation. Use the linked datasheet as the controlling source and re-check revisions before PCB release or firmware qualification.

THGBMFG8C2LBAIL FAQ

What is THGBMFG8C2LBAIL?

THGBMFG8C2LBAIL is a Kioxia (Toshiba Memory legacy) 32 GB embedded managed NAND flash memory compliant with eMMC 5.0. It belongs to the THGBMFG series.

What are the key specifications of THGBMFG8C2LBAIL?

Capacity is 32 GB, and Interface is JEDEC eMMC 5.0. Refer to the manufacturer datasheet for limits, test conditions and revision-controlled values.

What package does THGBMFG8C2LBAIL use?

THGBMFG8C2LBAIL is supplied in 11.5 mm x 13 mm x 0.8 mm FBGA with 153 pins, leads, balls or contacts. Verify the exact footprint and ordering suffix before PCB release.

Is THGBMFG8C2LBAIL still in production?

THGBMFG8C2LBAIL is obsolete or discontinued. Remaining stock should be checked for traceability, date code, package marking and storage history.

What should be checked before sourcing THGBMFG8C2LBAIL?

Confirm the complete MPN, electrical ratings, package, temperature grade and required quantity. Possible alternatives include Select a current Kioxia eMMC after verifying capacity, eMMC revision, voltage, package height, ball map and firmware behavior, but compatibility must be verified independently.

How THGBMFG8C2LBAIL differs from related orderable parts

THGBMFG8C2LBAIL belongs to the THGBMFG family. Compared with THGBMFG7C1LBAIL, the recorded differences include functional description: 32 GB embedded managed NAND flash memory compliant with eMMC 5.0 versus 16 GB embedded managed NAND flash memory compliant with eMMC 5.0 and Capacity: 32 GB, a higher recorded value than 16 GB. A shared family name does not establish pin, firmware or qualification compatibility.

Part numberRecorded functionPackagePins / contactsTemperatureLifecycle
THGBMFG8C2LBAIL32 GB embedded managed NAND flash memory compliant with eMMC 5.011.5 mm x 13 mm x 0.8 mm FBGA153 pins, leads or contacts-25 C to +85 C consumer class; confirm suffixObsolete
THGBMFG7C1LBAIL16 GB embedded managed NAND flash memory compliant with eMMC 5.011.5 mm x 13 mm x 0.8 mm FBGA153 pins, leads or contacts-25 C to +85 C consumer class; confirm suffixObsolete
THGBMFG6C1LBAIL8 GB embedded managed NAND flash memory compliant with eMMC 5.011.5 mm x 13 mm x 0.8 mm FBGA153 pins, leads or contacts-25 C to +85 C consumer class; confirm suffixObsolete
THGBMHG6C1LBAIL8 GB embedded managed NAND flash memory compliant with eMMC 5.111.5 mm x 13 mm x 0.8 mm FBGA153 pins, leads or contacts-25 C to +85 C consumer class; confirm suffixObsolete

For an RFQ or AVL review, quote the complete THGBMFG8C2LBAIL code and verify the manufacturer ordering table, package drawing, packing method and revision. The related numbers above are comparison references, not declared drop-in replacements.

Exact order-code identity for THGBMFG8C2LBAIL

For BOM, label, AVL and RFQ matching, preserve these visible code segments: opening alphabetic sequence THGBMFG; middle numeric sequence eight; middle alphabetic sequence C; middle numeric sequence two; and terminal alphabetic sequence LBAIL. The nearest published comparison codes are THGBMFG7C1LBAIL; THGBMFG6C1LBAIL; and THGBMHG6C1LBAIL. Compare every segment because a changed character can identify a different density, voltage, package, temperature, qualification or packing option.

Do not shorten the requested code to THGBMFG or remove its terminal characters. Ask the supplier to reproduce the complete code on the quotation and provide label or traceability evidence when exact suffix matching is mandatory.

Sourcing notes

Lifecycle and sourcing review

Obsolete

This part has a legacy lifecycle status. Submit the exact MPN, quantity, delivery destination and date-code requirements for a sourcing review.

THGBMFG8C2LBAIL is obsolete or discontinued. Require traceability, date-code, package-marking and storage-condition checks for remaining stock.

Alternatives

Potential alternative part numbers

Verify package, pinout, voltage, firmware behavior and qualification before substitution.