H9JCNNNBK3MLYR-N6E

H9JCNNNBK3MLYR-N6E Overview

H9JCNNNBK3MLYR-N6E is a SK hynix 16 Gb LPDDR5 mobile SDRAM for high-bandwidth, low-power systems supplied in 315-ball fine-pitch FBGA. This page uses the exact orderable code because package, grade, temperature and option suffixes can change compatibility.

Key Technical Specifications

Package and Ordering Notes

The listed package is 315-ball fine-pitch FBGA with 315 pins, leads, lands or contacts. The featured image is a generic package illustration for form-factor identification and is not an actual date-code or lot photograph. The part or family is listed by SK hynix as Production at the verification date.

Sourcing Guidance

Confirm current factory lead time, packing format and revision for H9JCNNNBK3MLYR-N6E before placing the order.

For an accurate quotation, include the full MPN, target quantity, acceptable date-code range, packaging format and destination. Icearth can help review traceability documents, label photos and electrical/package alignment before order placement.

Manufacturer Documentation

Technical values were checked against SK hynix documentation. Use the linked datasheet as the controlling source and re-check revisions before PCB release or firmware qualification.

H9JCNNNBK3MLYR-N6E selection and design context

H9JCNNNBK3MLYR-N6E is cataloged as a LPDDR5 SDRAM in the LPDDR5 family. Its recorded function is 16 Gb LPDDR5 mobile SDRAM for high-bandwidth, low-power systems. Selection should be based on the complete electrical limits, package drawing and ordering suffix rather than the abbreviated family code.

• Density: 16 Gb. Confirm address organization, software support and required usable capacity.
• Memory Type: LPDDR5 SDRAM. Confirm address organization, software support and required usable capacity.
• Organization: x32 mobile DRAM. Confirm address organization, software support and required usable capacity.
• Data Rate: Up to 6400 MT/s. Confirm system timing margin and the test conditions attached to the published limit.

Application and qualification considerations

When evaluating this component, confirm the ratings that control system compatibility, including supply conditions, interface or signal limits, timing, thermal behavior and package constraints. For a new design, review power-up behavior, interface timing, absolute maximum ratings, thermal limits and any external-component requirements in the latest manufacturer documentation. Existing-board replacement work should additionally confirm pinout, footprint, firmware assumptions and qualification grade.

Procurement checks for H9JCNNNBK3MLYR-N6E

The recorded package is 315-ball fine-pitch FBGA, the temperature range is -25°C to +85°C, and the lifecycle status is Production as of 2026-07-21. Before ordering, confirm the exact MPN on the label, packing format, quantity, date-code requirements, traceability documents and current factory status.

H9JCNNNBK3MLYR-N6E FAQ

How H9JCNNNBK3MLYR-N6E differs from related orderable parts

H9JCNNNBK3MLYR-N6E belongs to the LPDDR5 family. Compared with H9JCNNNCP3MLYR-N6E, the recorded differences include functional description: 16 Gb LPDDR5 mobile SDRAM for high-bandwidth, low-power systems versus 32 Gb LPDDR5 mobile SDRAM for high-bandwidth, low-power systems and Density: 16 Gb, a lower recorded value than 32 Gb. A shared family name does not establish pin, firmware or qualification compatibility.

For an RFQ or AVL review, quote the complete H9JCNNNBK3MLYR-N6E code and verify the manufacturer ordering table, package drawing, packing method and revision. The related numbers above are comparison references, not declared drop-in replacements.

Exact order-code identity for H9JCNNNBK3MLYR-N6E

For BOM, label, AVL and RFQ matching, preserve these visible code segments: opening alphabetic sequence H; middle numeric sequence nine; middle alphabetic sequence JCNNNBK; middle numeric sequence three; middle alphabetic sequence MLYR; middle alphabetic sequence N; middle numeric sequence six; and terminal alphabetic sequence E. The nearest published comparison codes are H9JCNNNCP3MLYR-N6E and H9JCNNNFA5MLYR-N6E. Compare every segment because a changed character can identify a different density, voltage, package, temperature, qualification or packing option.

Do not shorten the requested code to LPDDR5 or remove its terminal characters. Ask the supplier to reproduce the complete code on the quotation and provide label or traceability evidence when exact suffix matching is mandatory.

H9JCNNNBK3MLYR-N6E specification interpretation

The following notes interpret the recorded values for this exact orderable code. They are intended to make model-to-model differences visible during engineering and procurement review; the manufacturer datasheet remains the controlling source.

• Density: The recorded value is 16 Gb, expressed in words as sixteen Gb. Confirm address organization, software support and required usable capacity. The comparison record for H9JCNNNCP3MLYR-N6E lists 32 Gb; this page therefore preserves 16 Gb as the value associated with H9JCNNNBK3MLYR-N6E.
• Memory Type: The recorded value is LPDDR5 SDRAM, expressed in words as LPDDRfive SDRAM. Confirm address organization, software support and required usable capacity.
• Organization: The recorded value is x32 mobile DRAM, expressed in words as xthirty two mobile DRAM. Confirm address organization, software support and required usable capacity.
• Data Rate: The recorded value is Up to 6400 MT/s, expressed in words as Up to six thousand four hundred MT/s. Confirm system timing margin and the test conditions attached to the published limit.
• Supply: The recorded value is LPDDR5 multi-rail supply, expressed in words as LPDDRfive multi-rail supply. Check rail compatibility, tolerance and sequencing under worst-case conditions.