HN8T15DEHKX075

HN8T15DEHKX075 Overview

HN8T15DEHKX075 is a SK hynix 256 GB UFS 3.1 managed NAND storage for mobile and embedded systems supplied in 153-ball FBGA, 11 mm × 13 mm × 0.8 mm. This page uses the exact orderable code because package, grade, temperature and option suffixes can change compatibility.

Key Technical Specifications

Package and Ordering Notes

The listed package is 153-ball FBGA, 11 mm × 13 mm × 0.8 mm with 153 pins, leads, lands or contacts. The featured image is a generic package illustration for form-factor identification and is not an actual date-code or lot photograph. The part or family is listed by SK hynix as Production at the verification date.

Sourcing Guidance

Confirm current factory lead time, packing format and revision for HN8T15DEHKX075 before placing the order.

For an accurate quotation, include the full MPN, target quantity, acceptable date-code range, packaging format and destination. Icearth can help review traceability documents, label photos and electrical/package alignment before order placement.

Manufacturer Documentation

Technical values were checked against SK hynix documentation. Use the linked datasheet as the controlling source and re-check revisions before PCB release or firmware qualification.

HN8T15DEHKX075 selection and design context

HN8T15DEHKX075 is cataloged as a UFS Managed NAND in the UFS 3.1 family. Its recorded function is 256 GB UFS 3.1 managed NAND storage for mobile and embedded systems. Selection should be based on the complete electrical limits, package drawing and ordering suffix rather than the abbreviated family code.

• Capacity: 256 GB. Confirm address organization, software support and required usable capacity.
• Interface: UFS 3.1. Confirm logic levels, signaling mode, host support and required external components.
• NAND Stack: Four 512 Gb NAND die. Confirm the value and its datasheet test conditions for the exact ordering suffix.
• Package: 153-ball FBGA. Confirm the value and its datasheet test conditions for the exact ordering suffix.

Application and qualification considerations

When evaluating this component, confirm the ratings that control system compatibility, including supply conditions, interface or signal limits, timing, thermal behavior and package constraints. For a new design, review power-up behavior, interface timing, absolute maximum ratings, thermal limits and any external-component requirements in the latest manufacturer documentation. Existing-board replacement work should additionally confirm pinout, footprint, firmware assumptions and qualification grade.

Procurement checks for HN8T15DEHKX075

The recorded package is 153-ball FBGA, 11 mm × 13 mm × 0.8 mm, the temperature range is -25°C to +85°C, and the lifecycle status is Production as of 2026-07-21. Before ordering, confirm the exact MPN on the label, packing format, quantity, date-code requirements, traceability documents and current factory status.

HN8T15DEHKX075 FAQ

How HN8T15DEHKX075 differs from related orderable parts

HN8T15DEHKX075 belongs to the UFS 3.1 family. Compared with HN8T05DEHKX073N, the recorded differences include functional description: 256 GB UFS 3.1 managed NAND storage for mobile and embedded systems versus 128 GB UFS 3.1 managed NAND storage for mobile and embedded systems; Capacity: 256 GB, a higher recorded value than 128 GB; and NAND Stack: Four 512 Gb NAND die rather than Two 512 Gb NAND die. A shared family name does not establish pin, firmware or qualification compatibility.

For an RFQ or AVL review, quote the complete HN8T15DEHKX075 code and verify the manufacturer ordering table, package drawing, packing method and revision. The related numbers above are comparison references, not declared drop-in replacements.

Exact order-code identity for HN8T15DEHKX075

For BOM, label, AVL and RFQ matching, preserve these visible code segments: opening alphabetic sequence HN; middle numeric sequence eight; middle alphabetic sequence T; middle numeric sequence one five; middle alphabetic sequence DEHKX; and terminal numeric sequence zero seven five. The nearest published comparison codes are HN8T05DEHKX073N. Compare every segment because a changed character can identify a different density, voltage, package, temperature, qualification or packing option.

Do not shorten the requested code to UFS 3.1 or remove its terminal characters. Ask the supplier to reproduce the complete code on the quotation and provide label or traceability evidence when exact suffix matching is mandatory.