MX30LF1GE8AB-TI
1Gb 3V x8 SLC NAND Flash with internal ECC
Key details
| Part Number | MX30LF1GE8AB-TI |
|---|---|
| Manufacturer | Macronix |
| Category | SLC NAND Flash |
| Lifecycle Status | Production |
| Series | MX30LF1GE8AB |
| Package / Case | 48-TSOP (12x20mm) |
| Pin Count | 48 |
| Operating Temperature | -40°C to +85°C (Industrial) |
| Last Verified | 2026-07-17 |
Part information
MX30LF1GE8AB-TI Overview
MX30LF1GE8AB-TI is a Macronix 1Gb 3V x8 SLC NAND Flash with internal ECC supplied in 48-TSOP (12x20mm). This page uses the exact orderable code because package, speed, temperature and option suffixes can change compatibility.
Key Technical Specifications
| Memory Density | 1Gb |
|---|---|
| Cell Type | SLC NAND |
| Interface | Parallel NAND, x8 |
| Supply Voltage | 2.7V to 3.6V |
| Page Size | 2KB + spare area |
| ECC | Internal ECC always enabled; host ECC-free interface |
| Sequential Read | 20ns |
| Package | 48-TSOP, 12x20mm |
| Temperature Grade | Industrial, -40°C to +85°C |
Package and Ordering Notes
The listed package is 48-TSOP (12x20mm) with 48 pins/lands/balls. The featured image is a generic package illustration for form-factor identification and is not an actual date-code or lot photograph. The family is listed by Macronix as Production at the verification date.
Sourcing Guidance
The E8A option uses internal ECC always enabled. Confirm NAND geometry, spare-area handling, bad-block management and 48-TSOP pinout in the host controller.
For an accurate quotation, include the full MPN, target quantity, acceptable date-code range, packaging format and destination. Icearth can help review traceability documents, label photos and electrical/package alignment before order placement.
Manufacturer Documentation
Technical values were checked against Macronix documentation. Use the linked datasheet as the controlling source and re-check revisions before PCB release or firmware qualification.
MX30LF1GE8AB-TI selection and design context
MX30LF1GE8AB-TI is cataloged as a SLC NAND Flash in the MX30LF1GE8AB family. Its recorded function is 1Gb 3V x8 SLC NAND Flash with internal ECC. Selection should be based on the complete electrical limits, package drawing and ordering suffix rather than the abbreviated family code.
- Memory Density: 1Gb. Confirm address organization, software support and required usable capacity.
- Cell Type: SLC NAND. Confirm the value and its datasheet test conditions for the exact ordering suffix.
- Interface: Parallel NAND, x8. Confirm logic levels, signaling mode, host support and required external components.
- Supply Voltage: 2.7V to 3.6V. Check rail compatibility, tolerance and sequencing under worst-case conditions.
Application and qualification considerations
When evaluating this memory device, confirm density, organization, interface mode, supply rails, access or clock timing, erase endurance and software command compatibility. For a new design, review power-up behavior, interface timing, absolute maximum ratings, thermal limits and any external-component requirements in the latest manufacturer documentation. Existing-board replacement work should additionally confirm pinout, footprint, firmware assumptions and qualification grade.
Procurement checks for MX30LF1GE8AB-TI
The recorded package is 48-TSOP (12x20mm), the temperature range is -40°C to +85°C (Industrial), and the lifecycle status is Production as of 20260717. Before ordering, confirm the exact MPN on the label, packing format, quantity, date-code requirements, traceability documents and current factory status.
MX30LF1GE8AB-TI FAQ
What distinguishes MX30LF1GE8AB-TI within the MX30LF1GE8AB family?
MX30LF1GE8AB-TI is the exact orderable code for a 1Gb 3V x8 SLC NAND Flash with internal ECC in 48-TSOP (12x20mm). Related MX30LF1GE8AB devices may change package, rating, interface option or qualification grade, so compare the manufacturer ordering table before substitution.
What package and footprint checks are required for MX30LF1GE8AB-TI?
MX30LF1GE8AB-TI is recorded in 48-TSOP (12x20mm) with 48 pins, leads or contacts. Confirm the manufacturer package drawing, dimensions, pin numbering, exposed-pad requirements and packing suffix before releasing a PCB footprint.
Which specifications should be verified when selecting MX30LF1GE8AB-TI?
Memory Density is recorded as 1Gb, Cell Type is recorded as SLC NAND. Use the latest datasheet for minimum and maximum limits, test conditions, timing and absolute maximum ratings rather than relying only on a distributor summary.
What is the lifecycle status of MX30LF1GE8AB-TI?
MX30LF1GE8AB-TI was recorded as Production when verified on 20260717. Reconfirm factory status, revision availability, lead time and any last-time-buy notice before design-in or volume procurement.
What information should be included in an RFQ for MX30LF1GE8AB-TI?
Provide the complete MX30LF1GE8AB-TI orderable code, target quantity, acceptable date-code range, required packing method, delivery destination and documentation needs. For replacement work, also identify the existing package and any mandatory qualification grade.
Lifecycle and sourcing review
Lifecycle information is shown for reference. Confirm current manufacturer documentation, availability and technical suitability before purchase.
The E8A option uses internal ECC always enabled. Confirm NAND geometry, spare-area handling, bad-block management and 48-TSOP pinout in the host controller.