Find Electronic Component Part Numbers
Search or browse electronic component part numbers for obsolete, hard-to-find, EOL, NRND, and BOM sourcing requirements. Icearth uses an RFQ-led review process instead of displaying unverified public stock or pricing.
Start with an exact MPN
Enter a part number, manufacturer series, or package reference. The value will be carried into the RFQ form.
Latest Part Numbers
Published part records with sourcing notes, lifecycle information, documentation references and an RFQ path. This list updates automatically when a Part Number is published.
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H9TQ17ABJTMCUR-KUM
H9TQ17ABJTMCUR-KUM is a 16 GB eMMC and 16 Gb LPDDR3 combined memory for legacy mobile platforms in 221-ball FBGA, specified for -25°C to +85°C. Review verified technical data…
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H9TP32A4GDDCPR-KGM
H9TP32A4GDDCPR-KGM is a 32 GB eMMC and 16 Gb LPDDR3 combined memory for legacy mobile platforms in 221-ball FBGA, specified for -25°C to +85°C. Review verified technical data…
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H9JCNNNFA5MLYR-N6E
H9JCNNNFA5MLYR-N6E is a 64 Gb LPDDR5 mobile SDRAM for high-capacity, high-bandwidth systems in 315-ball fine-pitch FBGA, specified for -25°C to +85°C. Review verified technical data and request an…
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H9JCNNNCP3MLYR-N6E
H9JCNNNCP3MLYR-N6E is a 32 Gb LPDDR5 mobile SDRAM for high-bandwidth, low-power systems in 315-ball fine-pitch FBGA, specified for -25°C to +85°C. Review verified technical data and request an…
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H9JCNNNBK3MLYR-N6E
H9JCNNNBK3MLYR-N6E is a 16 Gb LPDDR5 mobile SDRAM for high-bandwidth, low-power systems in 315-ball fine-pitch FBGA, specified for -25°C to +85°C. Review verified technical data and request an…
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H9HP52ACPMADAR-KMM
H9HP52ACPMADAR-KMM is a 64 GB eMMC 5.1 and 32 Gb LPDDR4X combined memory for legacy mobile platforms in 254-ball FBGA, 11.5 mm × 13 mm, specified for -25°C…
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FEMDNN064G-A3A56
FEMDNN064G-A3A56 is a 64 GB industrial embedded MultiMediaCard with eMMC 5.1 interface and 3D TLC NAND in 153-ball FBGA, 11.5 mm × 13 mm × 0.8 mm, specified…
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FEMDNN032G-A3A55
FEMDNN032G-A3A55 is a 32 GB industrial embedded MultiMediaCard with eMMC 5.1 interface and 3D TLC NAND in 153-ball FBGA, 11.5 mm × 13 mm × 0.8 mm, specified…
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FDV302P
FDV302P is a -25 V P-channel digital MOSFET for compact low-current load switching in 3-pin SOT-23, specified for -55°C to +150°C junction. Review verified technical data and request…
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FDS4953
FDS4953 is a dual -30 V P-channel PowerTrench MOSFET for compact load-switching applications in 8-pin SOIC, specified for -55°C to +150°C junction. Review verified technical data and request…
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FDS4435
FDS4435 is a -30 V P-channel PowerTrench MOSFET for load switching and DC-DC conversion in 8-pin SOIC, specified for -55°C to +150°C junction. Review verified technical data and…
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FDP075N15A
FDP075N15A is a 150 V N-channel power MOSFET with low on-resistance for high-current switching in TO-220, 3 lead, specified for -55°C to +175°C junction. Review verified technical data…
Browse by Manufacturer
Explore part-number requirements by manufacturer. Additional records are added as verified part pages are published.
Macronix
Memory and Flash components, including NOR Flash requirements and lifecycle review.
Browse Macronix parts →Texas Instruments
Power, interface, analog, logic, and embedded component sourcing requirements.
Analog Devices
Analog, mixed-signal, interface, converter, and industrial component requirements.
Winbond
Memory and storage component requirements, including NOR Flash and related devices.
Browse by Category
Browse common electronic component categories and move from a sourcing requirement to the relevant published part record or RFQ path.
Memory
NOR Flash, EEPROM, storage, and memory IC sourcing requirements.
Browse Memory parts →Power Management
Regulators, PMICs, supervisors, controllers, and other power-related ICs.
Microcontrollers
Legacy MCU, embedded controller, EOL, and alternative-review requirements.
Interface ICs
Legacy interface, communication, signal, and industrial connectivity devices.
Obsolete, EOL and hard-to-find sourcing support
Icearth pages are structured for RFQ review rather than public inventory claims. Submit exact part numbers, quantity requirements, delivery country, package needs, and sourcing notes.
- Use the exact MPN and manufacturer whenever possible.
- Include package, quantity, date-code preference, and delivery country.
- Possible alternatives should be reviewed before technical approval.
- Availability, pricing, lead time, and compatibility remain subject to review and confirmation.
Have multiple line items?
Submit multiple MPNs, quantities, delivery requirements, and priority parts through the existing RFQ form.
Submit BOM RFQ →Can’t find the exact part number?
Submit the MPN, quantity, manufacturer, package, delivery country, and any technical notes. Icearth will review the request through the RFQ process.
Engineering research
Research before approving a component
Selection guides
Review application, ordering-code and sourcing context.
Exact part comparisons
Compare verified fields and compatibility limits.